Edge collapse rate: ≤ 0.3% (caused by equipment itself, excluding silicon wafer quality issues and other equipment impacts);

Fragmentation rate: ≤ 0.2% (caused by equipment itself, excluding silicon wafer quality issues and other equipment impacts;

Hidden crack rate: ≤ 0.2% (caused by the equipment itself, excluding silicon wafer quality issues and other equipment effects);

Adapting to silicon wafers: whole silicon wafers

① Silicon wafer type: single crystal silicon wafer

② Silicon wafer size: 166~230mm compatible, loading capacity of loading fixture ≥ 800 pieces, 182/210mm (compatible) fixture provided by the equipment manufacturer (4 pieces per machine), without additional charge.

Note: There is no compatibility between the full chip model and the half chip model

③ Silicon wafer thickness: 90 μ m ---220 μ m

④ Applicable cleaning basket: Both parties shall determine the form and overall dimensions of the flower basket in advance.

⑤ Capacity: 166~182mm ≥ 8300

210mm≥7500

230mm ≥ 7000 pieces/hour.

Control system: PLC programmable controller, AC servo system.

Fragment detection system: detects fragments, missing corners, and laminations and automatically removes them.

Air source flow rate: Inlet pipe diameter ≥ 10mm and cleaning machine interface: The wafer basket filled with silicon wafers is automatically and smoothly grabbed and cleaned through the built-in mechanical arm or device

Machine flipping turntable, process without human intervention.

Continuous working time: capable of working continuously for 24 hours

Power supply: AC220V (single-phase three wire), 50HZ

Equipment power: 7.0KW